JPH087638Y2 - 半導体装置のパッケージ - Google Patents

半導体装置のパッケージ

Info

Publication number
JPH087638Y2
JPH087638Y2 JP6031290U JP6031290U JPH087638Y2 JP H087638 Y2 JPH087638 Y2 JP H087638Y2 JP 6031290 U JP6031290 U JP 6031290U JP 6031290 U JP6031290 U JP 6031290U JP H087638 Y2 JPH087638 Y2 JP H087638Y2
Authority
JP
Japan
Prior art keywords
package
sealing resin
case
semiconductor device
lid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP6031290U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0420243U (en]
Inventor
文男 長畦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP6031290U priority Critical patent/JPH087638Y2/ja
Publication of JPH0420243U publication Critical patent/JPH0420243U/ja
Application granted granted Critical
Publication of JPH087638Y2 publication Critical patent/JPH087638Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP6031290U 1990-06-07 1990-06-07 半導体装置のパッケージ Expired - Lifetime JPH087638Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6031290U JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6031290U JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Publications (2)

Publication Number Publication Date
JPH0420243U JPH0420243U (en]) 1992-02-20
JPH087638Y2 true JPH087638Y2 (ja) 1996-03-04

Family

ID=31587568

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6031290U Expired - Lifetime JPH087638Y2 (ja) 1990-06-07 1990-06-07 半導体装置のパッケージ

Country Status (1)

Country Link
JP (1) JPH087638Y2 (en])

Also Published As

Publication number Publication date
JPH0420243U (en]) 1992-02-20

Similar Documents

Publication Publication Date Title
JPH087638Y2 (ja) 半導体装置のパッケージ
JPH04216661A (ja) 集積回路パッケージアセンブリ
CN220383331U (zh) 功率模块和包括功率模块的设备
JPS5824464Y2 (ja) 混成集積回路装置
JPS62104145A (ja) 半導体装置
JPS6328607Y2 (en])
JPH0726844Y2 (ja) 混成集積回路
JPH06188335A (ja) 樹脂封止形半導体装置
CN217768357U (zh) 一种传递模型碳化硅智能功率模组
JPS629730Y2 (en])
JPH0526760Y2 (en])
JPS585348U (ja) 樹脂封止型半導体装置
JPH0432758Y2 (en])
JPH0236281Y2 (en])
JPH0353509Y2 (en])
KR100246368B1 (ko) 반도체 패키지 및 그 제조방법
CN118658846A (zh) 包括无源电子部件的功率半导体封装及其制造方法
JPH0530363Y2 (en])
JPH03108364A (ja) パワーｉｃ装置
JPH0810950Y2 (ja) 電力半導体装置
JPS63127137U (en])
JPH0837270A (ja) 半導体装置およびその製造方法
JPS6249244U (en])
JPS59164242U (ja) 半導体装置
JPH05259335A (ja) 樹脂封止形半導体装置

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term